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The Specification of Rigid Boards:
| Number of layers |
1 to 20 |
| Board Thickness |
0.006"-0.236" (0.15-6.0mm) |
| Min. Innerlayer Thickness |
0.003" (0.076mm) |
| Max. panel size |
21" x 24" (533X610mm) |
Min. hole size
(Blind & buried via holes) |
0.008" (0.2mm) For Mechanical
0.004" (0.1mm) For Microvia |
| Min. line width/ spacing |
0.003" (0.076mm) |
| Electric test voltage |
Max. 250V |
| Base material |
Paper phenolic, CEM1, CEM3,
FR1, FR2, FR4, FR4 (Halogen free), FR5,
PTFE, BT, Rogers Getek, Aluminium substrate etc. |
| Finish |
HAL, OSP (Entek), Flash gold,
Immersion Gold, Tin, Silver,
Gold finger, Carbon, Peelable mask,
Impedance Control etc. |
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Rigid Specification
Rigid Sample
